| 摘要 |
A wafer polishing device having a cooling unit is provided to control a polishing temperature under a constant level in a polishing process by cooling a top surface plate of a polishing apparatus. A thermoelectric semiconductor is installed on one of a top surface plate(50) and a bottom surface plate(40). A temperature sensor is used for sensing a temperature of the top surface plate or the bottom surface plate on which the thermoelectric semiconductor is installed. A control unit(55) is connected to the thermoelectric semiconductor and the temperature sensor in order to control an operation of the thermoelectric semiconductor according to a variation of temperature of the top surface plate or the bottom surface plate. The temperature of the top surface plate or the bottom surface plate is reduced by operating the thermoelectric semiconductor device when the temperature of top surface plate or the bottom surface plate is increased by a polishing process.
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