发明名称 Light emitting diode assembly having high-performance heat dissipation means
摘要 A light source assembly includes a vapor chamber, which has an electrical circuit installed in the top surface, an insulation layer covered in between the top surface of the vapor chamber and the electrical circuit, and light emitting diodes installed in the top surface directly of the vapor chamber and electrically connected to the electrical circuit for producing light upon connection of electricity to the electrode circuit means and the vapor chamber, and a heat sink installed in the bottom surface of the vapor chamber for dissipation of heat energy from the vapor chamber into outside open air. <IMAGE>
申请公布号 EP1523041(A1) 申请公布日期 2005.04.13
申请号 EP20040029111 申请日期 2004.12.08
申请人 CHEN, JEFFREY 发明人 NEOBULB TECHNOLOGIES, INC.
分类号 F21K99/00;H01L25/075;H01L33/64 主分类号 F21K99/00
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