发明名称 Semiconductor device and method of manufacturing the same
摘要 An aspect of the present invention includes a first conductive type semiconductor region; a gate electrode formed on the first conductive type semiconductor region; a channel region formed immediately below the gate electrode in the first conductive type semiconductor region; and a second conductive type first diffusion layer constituting source/drain regions formed at opposite sides of the channel region in the first conductive type semiconductor region, the gate electrode being formed of polycrystalline silicon-germanium, in which a germanium concentration is continuously increased from a drain region side to a source region side, and an impurity concentration immediately below the gate electrode in the first conductive type semiconductor region being continuously increased from the source region side to the drain region side in accordance with the germanium concentration in the gate electrode.
申请公布号 US6878579(B2) 申请公布日期 2005.04.12
申请号 US20040917345 申请日期 2004.08.13
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 OHUCHI KAZUYA;FUKUI HIRONOBU
分类号 H01L21/28;H01L21/336;H01L21/8234;H01L29/49;H01L29/78;(IPC1-7):H01L21/335;H01L21/425 主分类号 H01L21/28
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