METHOD OF CHIP BONDING

摘要

A method for bonding a chip is provided to bond a chip at a lower process pressure and a lower process temperature than a conventional bonding process by connecting both solder bumps through a partial melting in a lower temperature than the melting point of each bump. A metal thin film patterned is respectively formed on a first and second bonding members(10,20). A bump composed of at least one of solders(16) or metals having different melting point each other is formed on the first and second bonding members, the bump covers the metal thin film. A metallurgical bond between interfaces of bumps formed on the top of the first and second bonding members is induced by applying heat of a lower temperature than a melting point of the bumps after aligning the first bonding member on the top of the second bonding member.