METHOD OF SEPARATING SEMICONDUCTOR WAFER, AND SEPARATING APPARATUS USING THE SAME

摘要

A method for separating a semiconductor wafer and a separating apparatus using the same are provided to have only a small separation stress by separating a semiconductor wafer from a double faced adhesive sheet. A semiconductor wafer(1) is adhered to a support member(2) with a double faced adhesive sheet(3) being interposed therebetween. The resistance of an adhesive power of the double faced adhesive sheet against the separation is weakened by separating the semiconductor wafer from the double faced adhesive sheet. The semiconductor wafer is separated from the double faced adhesive sheet in a non-contact condition while the adhesive power of the double faced adhesive sheet is weakened.