ELECTRO STATIC CHUCK FOR CHUCKING THE WAFER

摘要

An electrostatic chuck for chucking a wafer is provided to reduce the set up time of an equipment and to prevent an error due to an electric current by aligning easily the height of ground pins by thickening a bolt hole boss of the back end of leaf spring. An electrostatic chuck for chucking a wafer is provided with a ground pin and a leaf spring. The ground pin is placed at the front end of the electrostatic chuck, the leaf spring(32) having a bolt hole for joining to a support is placed at the rear end thereof. A reinforced boss(A) is formed at the back end of the electrostatic chuck at which a bolt hole(32a) is formed. The reinforced bolt hole receives the torque due to bolting, so that the torque is not transferred to the front end side of the electrostatic chuck.