METHOD FOR SEPARATING SEMICONDUCTOR WAFER FROM SUPPORTING MEMBER, AND APPARATUS USING THE SAME

摘要

A method for separating a semiconductor wafer from a supporting member and an apparatus using the same are provided to separate smoothly from a support member being integral with a dicing frame by weakening effectively the adhesive power of a double faced adhesive sheet. A semiconductor wafer(1) is adhered to a support member(2) with a double faced adhesive sheet(3) being interposed therebetween. The semiconductor wafer is secured to a dicing frame(5) after a dicing tape(4) is adhered to the semiconductor wafer. The semiconductor wafer being integral with the dicing frame is separated from the support member.