发明名称 Glass-ceramic composite material and multilayered circuit substrate
摘要 A glass-ceramic composite material for use in forming a multilayered circuit substrate is provided which has a low dielectric constant, but exhibits a relatively high thermal expansion coefficient. Specifically, the glass-ceramic composite material comprises a glass power and a ceramic powder. The glass powder contains: about 30 to 60 mol % of SiO2, about 20 to 40 mol % of BaO, 0 to about 40 mol % of MgO, 0 to about 40 mol % of ZnO, 0 to about 20 mol % of B2O3, with the total content of MgO and ZnO being about 10 to 40 mol %. The ceramic powder contains an alumina powder. The content of the glass powder is set to be at least about 50 wt %. A sintered compact formed by sintering the above glass powder and the above ceramic powder contains a BaO.Al2O3.2SiO2 (BaAl2Si2O8) crystal, and its Q value becomes about 400 or more when a measured frequency is 10 GHz.
申请公布号 US6878464(B2) 申请公布日期 2005.04.12
申请号 US20020277045 申请日期 2002.10.22
申请人 MURATA MANUFACTURING CO., LTD. 发明人 MORIYA YOICHI;CHIKAGAWA OSAMU;SUGIMOTO YASUTAKA
分类号 C04B35/20;C03C14/00;C04B35/195;H01L23/15;H05K1/03;H05K3/46;(IPC1-7):B32B9/00 主分类号 C04B35/20
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