SEMICONDUCTOR CHEMICAL AND MECHANICAL POLISHING APPARATUS USING PAD BLOCK

摘要

A CMP apparatus for a silicon wafer is provided to prevent an edge exclusion of a silicon wafer and to obtain the good pad condition of the CMP apparatus using a pad block or by heightening the bottom surface of a retaining ring than the position of a silicon wafer. A CMP apparatus for a silicon wafer includes a polishing head, a pad, a pad conditioner disk and a plurality of pad blocks. A silicon wafer(10) is fixed by the polishing head(20). The wafer is contacted with the pad. The pad is conditioned by the pad conditioner disk. The plurality of pad blocks are installed at regular intervals on the circumferential surface of the pad. A retaining ring(200) of the polishing head is formed at the higher position than the wafer fixed thereto.