发明名称 |
Method of polishing wafers |
摘要 |
The method comprises the steps of mounting a first wafer (13) on the mounting member (12) and securing the mounting member to the hub (16) by drawing a vacuum at a first vacuum pressure through the hub; rotating the hub about the hub axis (AH), rotating a polishing pad (34) mounted on the turntable (30) about the turntable axis (at), and bringing a surface of the wafer (13) and the polishing pad into contact with each other. The wafer (16) is demounted, and the shape of the polished wafer is determined. A second vacuum pressure is selected using the information obtained. A successive wafer is polished according to the same method as the first wafer except that the second vacuum pressure is substituted for the first vacuum pressure. The second vacuum pressure is sufficient to deform the mounting member (12) thereby deform the wafer to improve the flatness and parallelism of the surfaces of the successive wafer.
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申请公布号 |
US6878302(B1) |
申请公布日期 |
2005.04.12 |
申请号 |
US20020239669 |
申请日期 |
2002.12.03 |
申请人 |
MEMC ELECTRONIC MATERIALS, SPA |
发明人 |
CORBELLINI PARIDE;NEGRI GIOVANNI;BOVIO EZIO;MOIRAGHI LUCA |
分类号 |
B24B49/04;B24B37/04;B24B49/03;B24B51/00;H01L21/304;(IPC1-7):H01L21/302 |
主分类号 |
B24B49/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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