| 摘要 |
A semiconductor laser is provided to form an inexpensive frame structure having the same shape as an existing can type structure by using a lead frame and a mold resin. A die pad(11a) and a plurality of leads(11-13) are formed by a plate-shaped lead frame(1). A resin part(2) is formed with a mold resin for integrally supporting the die pad(11a) and the leads(11-13). A laser chip(4) is mounted on one surface of the die pad(11a). The resin part(2) includes a base portion(21) and a die pad holding portion(22). The base portion(21) holds integrally the leads(11-13) and has a substantially round shape in an external shape thereof. The die pad holding portion(22) is continuously formed above the base portion(21), and holds a rear surface and lateral portions of the die pad, and has an external shape that is included inside a circle having a diameter smaller than an outer diameter of the substantially round shape of the base portion(21). |
