发明名称 |
Lid assembly for a processing system to facilitate sequential deposition techniques |
摘要 |
A lid assembly for a semiconductor processing system is provided. The lid assembly generally includes a lid having a gas manifold mounted on a first side and a baffle plate mounted on a second side. The gas manifold is configured to deliver a plurality of gases to a plenum defined between the baffle plate and the lid. The gases are mixed within a recess formed in the baffle plate before exiting into the processing system through a singular passage.
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申请公布号 |
US6878206(B2) |
申请公布日期 |
2005.04.12 |
申请号 |
US20010016300 |
申请日期 |
2001.12.12 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
TZU GWO-CHUAN;UMOTOY SALVADOR P. |
分类号 |
C23C16/44;C23C16/455;H01L21/00;(IPC1-7):C23C16/00 |
主分类号 |
C23C16/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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