发明名称 |
Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same |
摘要 |
The present invention provides a biphenyl based epoxy resin comprising a curing agent and an inorganic filler containing an alkali alkaline earth metal oxide wherein the epoxy resin has a variation rate of hardness at 25° C. and a relative humidity of 50% for 72 hours of less than 10% and a variation rate of flow at 25° C. and a relative humidity of 20% or below for 72 hours of less than 20%. |
申请公布号 |
US6878448(B2) |
申请公布日期 |
2005.04.12 |
申请号 |
US20010961746 |
申请日期 |
2001.09.25 |
申请人 |
HITACHI, LTD. |
发明人 |
ISHII TOSHIAKI;KOKAKU HIROYOSHI;NAGAI AKIRA;MIWA TAKAO |
分类号 |
C08L63/02;C08G59/22;C08G59/24;C08G59/62;C08K3/22;C08K3/36;C08K3/38;C08L63/00;H01L23/29;H01L23/31;(IPC1-7):B32B27/38;H01L21/56 |
主分类号 |
C08L63/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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