发明名称 |
Chemical solution treatment apparatus for semiconductor substrate |
摘要 |
A chemical solution treatment apparatus for dissolving and removing ruthenium-based metal adhering to a substrate by a chemical solution, includes: a chemical solution treatment unit; a reservoir unit; and a chemical solution circulation system. The chemical solution inside treatment unit comprises a chemical solution supplying nozzle, and a recovering mechanism. The reservior unit has a structure having a clearence part to be in contact with the chemical solution so that gas components derived from the ruthenium-based metal dissolved and removed in said chemical solution treatment are volatilized outside the chemical solution during circulation of the chemical solution, and comprises an exhaust duct.
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申请公布号 |
US6877518(B2) |
申请公布日期 |
2005.04.12 |
申请号 |
US20020309132 |
申请日期 |
2002.12.04 |
申请人 |
NEC ELECTRONICS CORPORATION;KANTO KAGAKU KABUSHIKI KAISHA |
发明人 |
WATANABE KAORI;AOKI HIDEMITSU;ISHIKAWA NORIO;MORI KIYOTO |
分类号 |
C23F1/08;C23F1/30;H01L21/00;H01L21/304;(IPC1-7):B08B15/00 |
主分类号 |
C23F1/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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