Semiconductor component e.g. integrated circuit chip, has protection chip placed in front of optical sensor, where front side of protection chip is covered by protection layer made up of material filtering infrared rays

摘要

The chip has a protection chip (14) placed in front of an optical sensor (10) and not covering electrical bonding pads (11). The chip (14) is fixed on the front side of the chip by a wire (16) made up of adhesive material. The wire remotely extends annularly from a side of the sensor to the pads. The front side of the chip (14) is covered by a protection layer (17) made up of material filtering infrared rays. An independent claim is also included for a semiconductor package.