THE METHOD AND APPARATUS FOR SILICON WAFER LASER DICING WITH SURFACTANT COATING

摘要

A method for laser-dicing a silicon wafer by a surfactant coating method is provided to reduce an interval of fabrication time and a defective proportion and improve yield by minimizing contamination by the debris generated in dicing a silicon wafer by a laser beam and an influence of heat upon a process part. Water-soluble surfactant is thinly coated on a silicon wafer(8). The dicing line of the silicon wafer coated with the surfactant is checked and recognized by using a high-magnification CCD(charge coupled device) camera and a computer. The silicon wafer whose dicing line is recognized is freely irradiated and diced by a UV(ultraviolet) laser beam(12) of 200-500 nanometers while using a scanner and an orthogonal robot. The diced silicon wafer is cleaned.