| 摘要 |
PROBLEM TO BE SOLVED: To provide a multipurpose substrate treating device that can exhibit the cleaning effect corresponding to a new material or manufacturing process introduced to a semiconductor device and, in addition, can cope with the need to the cleaning technique which is considered to become higher in future as the further micronization and higher integration of the semiconductor device advance. SOLUTION: The substrate treating device is provided with a substrate holder 3 which holds a substrate W, a head 12 disposed to face the substrate W held by the holder 3, and a treating liquid supplying source 27 which supplies a treating liquid between the substrate W held by the holder 3 and the head 12. On the surface of the head 12 facing the substrate W, an anode 21, a cathode 22, and an ultrasonic vibrator 20 which emits an ultrasonic wave toward the treating liquid are disposed. COPYRIGHT: (C)2005,JPO&NCIPI
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