| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a wire for a wire harness capable of providing a wire having reasonably low adhesiveness between an insulation layer and an external semiconductor layer, and having excellent terminal workability. SOLUTION: This manufacturing method of the wire for a wire harness has: a process for forming the insulation layer 30 in the outside of a conductor 10 by extrusion; and a process for forming the external semiconductor layer 40 outside the insulation layer 30 by extrusion independent of the extrusion for the insulation layer 30. By individually forming the insulation layer 30 and the external semiconductor layer 40 by extrusion, the wire reasonably lowered in adhesiveness between both the layers can be provided. Thereby, a separation work of the semiconductor layer 40 in the terminal treatment can easily be carried out. COPYRIGHT: (C)2005,JPO&NCIPI
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