| 摘要 |
PROBLEM TO BE SOLVED: To accurately obtain a two-dimensional image at high resolution, regardless of manufacturing errors, moving speed fluctuations of a sample, manufacturing errors in a lithography process, a fluctuation of enlarging magnification, irregularities of a sample face. SOLUTION: An equally spaced grid, in which dice 54 are virtually disposed, is produced so as to inspect patterns in the dice 54 regularly disposed in two axial directions which are not mutually parallel on a wafer 51. Actual location coordinates of each die 54 are found. The location error between the equally spaced grid and each die 54 is calculated. The location of an image of each die 54 is corrected, based on the location error of each die 54 so as to dispose the image of each die 54 along the equally spaced grid, and the image is obtained. Defects in the pattern on the die 54 are inspected, based on the obtained image whose location is corrected. COPYRIGHT: (C)2005,JPO&NCIPI
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