| 摘要 |
PROBLEM TO BE SOLVED: To obtain a curing accelerator capable of imparting an excellent preservation property, a good curing property and a flowing property to a thermosetting resin composition, an epoxy resin composition having the above characteristics and a semiconductor device excellent in solder crack resistance and reliability in moisture resistance. SOLUTION: The curing accelerator is expressed by formula (1) [wherein, R<SP>1</SP>to R<SP>3</SP>are each a substituted or unsubstituted aromatic or alkyl group; Ar is an aromatic group substituted with a substituent except for hydroxy or unsubstituted; R<SP>4</SP>to R<SP>7</SP>are each a substituted or unsubstituted monovalent aromatic or alkyl group and at least one of them is a group obtained by releasing 1 proton from a proton donor having protons capable of being released; and (n) is a number of≥1]. The epoxy resin composition contains a compound having≥2 epoxy groups, a compound having≥2 phenolic hydroxy groups and the curing accelerator, and the semiconductor device is obtained by sealing a semiconductor element with the cured material of the epoxy resin composition. COPYRIGHT: (C)2005,JPO&NCIPI
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