| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic circuit test board that is capable of arranging lead wires in order with appearance close to a circuit diagram as much as possible, utilizing various electronic components on the market and also dealing with a large scale circuit. SOLUTION: As a method of connecting an electronic component and a conductor, small block-like elastic objects are arrayed and fixed at pitches of 2.54mm that are pin intervals of a DIP or an SIP package IC to make a gap of these blocks equivalent to the thickness of one lead wire or so. In the gap of the blocks, a board is pierced with a through hole. Besides, a groove is engraved in midpoints on four sides of an upper face of each block and when a pins or a lead wire of the electronic component and one terminal of the conductor connected therewith are inserted into the through hole and the lead wire and the conductor are then passed through the groove, the gap of the blocks is narrow so that the both are overlapped with each other just under the groove and the gap of the blocks is widened by the deformation of the elastic objects. At such a time, the both are fixed at opposite positions just under the groove, and the both are surely contacted by the elastic force of the block. COPYRIGHT: (C)2005,JPO&NCIPI
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