发明名称 DIAMOND TOOL
摘要 A segment type diamond tool has diamond particles appropriately distributed on segments of the diamond tool, thereby providing an excellent cutting rate and reducing fine debris generated during a cutting operation. The diamond tool comprises a plurality of segments, each of the segments having a single plate-shaped layer or a plurality of plate-shaped layers of diamond particles arranged thereon, and the layers of diamond particles being arranged on the segment such that cutting grooves formed on a workpiece by a trailing layer of diamond particles are arranged between cutting grooves formed thereon by a leading layer of diamond particles, respectively, during a cutting operation on the workpiece, wherein the diamond particles are arranged at a predetermined tilt angle to a line connecting upper vertices or a line connecting lower vertices of a cross section, cut parallel in a cutting direction and perpendicular to a cutting surface, so that the diamond particles are protruded and uniformly spaced from each other on the cutting surface of the segment during the cutting operation on the workpiece.
申请公布号 WO2005014243(A3) 申请公布日期 2005.04.07
申请号 WO2004KR02004 申请日期 2004.08.10
申请人 EHWA DIAMOND INDUSTRIAL CO., LTD.;GENERAL TOOL, INC.;KIM, SOO-KWANG;KIM, JONG-HO;PARK, HEE-DONG 发明人 KIM, SOO-KWANG;KIM, JONG-HO;PARK, HEE-DONG
分类号 B23D61/02;B22F3/00;B22F7/06;B23D61/18;B23D63/02;B24D5/12;B26D;B28D1/04;B28D1/12;C22C26/00 主分类号 B23D61/02
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