| 摘要 |
PROBLEM TO BE SOLVED: To improve productivity and cost performance by making it unnecessary to carry out processing of discard materials, and unnecessary to alter a dicing device or core drill or the like in removing a beveled outer peripheral part being the factor of the damage of a wafer before polishing the wafer. SOLUTION: When an outer peripheral side face 15 is beveled, and a face of the wafer where a necessary region is surrounded by an unnecessary region is polished, a groove 16 with predetermined depth is formed on the non-polished face of the unnecessary region, and the necessary area is surrounded by an inside wall configuring the groove, and a protecting member is adhered to at least the non-polished face of the necessary region, and a protecting tape side is placed on a check table, and the polished face of the wafer is polished by a polishing means, and the groove is exposed from the polished face. Thus, the unnecessary part is destroyed by polishing so that it is not necessary to carry out the processing of discard materials. COPYRIGHT: (C)2005,JPO&NCIPI |
