发明名称 ELECTRONIC APPLIANCE CIRCUIT
摘要 PROBLEM TO BE SOLVED: To obtain an electronic appliance circuit where LSI design is easy even in a fast circuit and which is small and operates stably by reducing variation of signal propagation delay time inside of LSI with respect to temperature variation. SOLUTION: The temperature of an LSI package case is detected by a thermister Rth1 of a temperature negative characteristic and thermister Rth2 of a temperature positive characteristic, and intermediate voltage Vk obtained by dividing LSI driving voltage is compared with reference voltage by an error amplifier 2. The intermediate voltage is varied by the variation of the resistance value of a thermister with the temperature of the package case of the LSI. The variation of the intermediate voltage is compared with the voltage of a reference signal source by an error amplifier to control LSI driving voltage. By controlling the LSI driving voltage to be high when the temperature of the package case is high and to be low when the temperature of the package case is low, variation of the signal propagation delay time inside of the LSI with respect to temperature (delay coefficient) is reduced. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005092793(A) 申请公布日期 2005.04.07
申请号 JP20030328929 申请日期 2003.09.19
申请人 NEC ENGINEERING LTD 发明人 UNO SEIICHI
分类号 H01L23/34;G05F1/56;(IPC1-7):G05F1/56 主分类号 H01L23/34
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