LAMINATE, MANUFACTURING METHOD OF THE SAME, CIRCUIT BOARD USING THIS, AND MANUFACTURING METHOD OF THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a laminate which can be applied to a high-density semiconductor package by solving the problem that forming of a minute pattern is difficult due to the side etching of a conductor pattern in the case of forming the conductor pattern by etching by using a laminated plate charged with conductive paste and that reliability is low since sufficient adhesion is not obtained between an electroless plating layer and an interlayer insulating layer in the case of forming the conductor pattern with the electroless plating layer as a power feeding layer, and to provide a manufacturing method of a circuit board using the laminate. SOLUTION: The laminate 10 has an interlayer connection part hardened by charging a conductive paste 5 into at least an interlayer insulation resin layer 3 of the outermost layer and a metallic foil 7 at the outermost layer. The manufacturing method has at least a process of forming an electric plating resist 11 on the surface of the metallic foil using the laminate where the thickness of the metallic foil is≤5μm and thereafter performing electric copper plating with the metallic foil as the power feeding layer, and a process of forming the conductor pattern 13 by removing the electric plating resist and performing etching removal of the metallic foil other than a pattern part. COPYRIGHT: (C)2005,JPO&NCIPI