发明名称 Electronic housing assembly and method
摘要 A housing assembly (100) and method (300) of assembly includes a housing (105) having one or more recessed areas (130) on at least a first side (120). Also included is a floor member (110) having one or more protrusions (135) and is pivotably mounted to one or more recessed areas on the first side using the protrusions. A tubular member (115) is included for engaging the floor member on a second side (125) of the housing where the engagement prevents the floor member from pivoting. The method of assembly includes engaging and pivotably mounting (310) a first portion of a floor member to a first side of a housing and pivoting (315) the floor member to an assembled position. The method further includes engaging (320) a second portion of the floor member by slidably introducing a tubular member through the housing and adjacent to a blocking structure of the floor member, thereby substantially preventing further pivoting of the floor member.
申请公布号 US2005073821(A1) 申请公布日期 2005.04.07
申请号 US20030679548 申请日期 2003.10.06
申请人 MOTOROLA, INC. 发明人 PAGE KEVIN D.;MOSKOWITZ DOUGLAS W.
分类号 H04M1/02;H04M1/725;(IPC1-7):H05K7/14;H05K7/18 主分类号 H04M1/02
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