Semiconductor memory device

摘要

A semiconductor device package includes a plurality of semiconductor memory devices whose address input terminals are commonly connected to the external address input pins of the package, and an internal address generating device for using an address signal applied through at least one of the address input pins to select one of the memory devices to perform a read/write data operation. Only the selected memory device is enabled to perform the read/write operation on a memory cell corresponding to the received address signal. The external pin configuration of the semiconductor device package is compatible with a conventional memory board layout.