发明名称 PLASMA PROCESSING SYSTEM
摘要 <p>A processing system (100) includes a processing chamber (120) having a substrate holder (130) and an electrode (125). The processing system includes a compression control system, a gas supplying system, and a monitor device (160). The electrode (125) is connected to a multi-frequency RF power supply (110) via a matching circuit (115) having a single variable element. The multi-frequency RF power supply is set to a first frequency so as to ignite plasma or set to a second frequency so as to sustain the plasma.</p>
申请公布号 WO2005031839(A1) 申请公布日期 2005.04.07
申请号 WO2004JP14407 申请日期 2004.09.30
申请人 TOKYO ELECTRON LIMITED;ADVANCED ENERGY INDUSTRIES, INC.;MIYOSHI, HIDEAKI;DHARMASENA, GEMUNU, RANJITH;HIGASHIURA, TSUTOMU;GILMORE, JACK, A.;OSSELBURN, JOSEPH, J.;BEIZER, THERESA 发明人 MIYOSHI, HIDEAKI;DHARMASENA, GEMUNU, RANJITH;HIGASHIURA, TSUTOMU;GILMORE, JACK, A.;OSSELBURN, JOSEPH, J.;BEIZER, THERESA
分类号 H01J37/32;H01L21/205;H01L21/3065;H01L21/324;H01L21/42;(IPC1-7):H01L21/306 主分类号 H01J37/32
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