| 摘要 |
PROBLEM TO BE SOLVED: To solve problems of the increase of the number of workpiece types and the increase of cost in a conventional burn-in method wherein a dedicated burn-in board is required for finished good inspection, a dedicated probe card is required for each workpiece type for inspection with the workpieces on a wafer, and dedicated burn-in circuits and patterns for the burn-in of each of the transistors. SOLUTION: In this semiconductor inspection apparatus, a wafer is placed in a fluid and pressure is applied to the fluid, so that mechanical stresses are impressed on all transistors. In this way, a nearly disconnected part in the transistor is completely destroyed by the stress, and an early-stage failure can be eliminated. A dedicated burn-in board or a dedicated probe card is not required for each workpiece type, and a conventional dedicated burn-in circuit is not required. COPYRIGHT: (C)2005,JPO&NCIPI
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