| 发明名称 |
Pad structure for stress relief |
| 摘要 |
A structure is disclosed for corners of metallic features of semiconductor integrating circuits. In the disclosed structure corner angles of all corners of metallic features that are imbedded in dielectric layers are greater than 90 degrees.
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| 申请公布号 |
US2005074918(A1) |
申请公布日期 |
2005.04.07 |
| 申请号 |
US20030680578 |
申请日期 |
2003.10.07 |
| 申请人 |
TAIWAN SEMICONDUTOR MANUFACTURING CO. |
发明人 |
LEE TZE-LIANG;JENG SON-MING;CHEN SHIH-CHANG;YU DOUGLASS |
| 分类号 |
H01L21/44;H01L23/485;H01L23/528;(IPC1-7):H01L21/44 |
主分类号 |
H01L21/44 |
| 代理机构 |
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