| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an interconnect line sheet in which a low-resistance interconnect line is formed through a low-temperature process, and to provide a method of manufacturing the same. <P>SOLUTION: A metal foil 1 where through-holes 5 are bored is subjected to an anodizing treatment in a suspension where an inorganic filler is suspended, whereby a ceramic film 6 is formed on the surface of the metal foil 1 with the through-holes 5 for the formation of a base material 7. Interconnect lines 12 are formed on, at least, the one surface of the base material 7 through a plating method, and thus the interconnect line sheet 13 can be realized. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
