| 摘要 |
PROBLEM TO BE SOLVED: To reduce the number of rewinding of a tape carrier and improve inspection yield in an automatic visual inspection device. SOLUTION: Contaminations deposited on a wiring pattern are removed in-line in a carrier process from a feeding reel 1 to a take-up reel 5 of a semiconductor device tape carrier 2, which is subjected to automatic visual inspection. At least one kind selected from a means 7 for bringing an adhesive roller into contact with a wiring pattern surface, a means 8 for spraying air to the wiring pattern surface or an attraction means 9 by magnetism can be used for removal operation of deposited contaminations. These contaminations removal means can be provided upstream of a visual inspection position and can be also provided to a position just before the take-up reel 5. COPYRIGHT: (C)2005,JPO&NCIPI
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