| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition suitable for encapsulation of an area mounting-type semiconductor with less warpage and excellent resistance to soldering crack, and a semiconductor device using the same. SOLUTION: This epoxy resin composition for encapsulation of the area mounting-type semiconductor comprises (A) a phenol aralkyl-form epoxy resin having a biphenylene backbone, (B) a crystalline biphenol-form or bisphenol-form epoxy resin (wherein the weight ratio (A)/(B) is 10/90-90/10), (C) a phenol aralkyl resin having a biphenylene backbone, (D) a hardening accelerator, (E) an inorganic filler of 80-94 wt% based on the total epoxy resin composition, and (F) a compound, of 0.01-1 wt% based on the total epoxy resin composition, having≥2 adjacent hydroxy groups on an aromatic ring and having a substituent other than the hydroxy group or not. The semiconductor device is provided by encapsulating a semiconductor element using the epoxy resin composition. COPYRIGHT: (C)2005,JPO&NCIPI
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