Method and system for shipping semiconductor wafers

摘要

According to one embodiment of the invention, an apparatus includes a plurality of coin stacks of semiconductor wafers. Each coin stack includes a plurality of semiconductor wafers separated from an adjacent wafer by a wafer separator disposed within a coin stack carrier. The apparatus also includes a shipping box having the plurality of coin stacks disposed therein such that each of the wafers in each of the coin stack carriers has a vertical orientation.