DEVICE FOR FITTING SUBSTRATES WITH ELECTRICAL COMPONENTS

摘要

A fitting head (3) can be displaced in two co-ordinate directions (x, y) parallel to the substrate (1). The access area thereof (24) is large enough to cover a wafer (25) which is parallel to the substrate (1) and additional component admissions (15) which are arranged adjacent to a wafer table (21) supporting the wafer (25). It is also possible to use, in addition to the components (2) of the wafer (25), other components (2) for the production of complex circuits.