发明名称 |
Method of separating semiconductor wafer, and separating apparatus using the same |
摘要 |
With respect to a work obtained by joining a semiconductor wafer and a supporting member to each other via a both-faced adhesive sheet having heating separability, the surface of the supporting member is suction-held at a suction stage and is heated, thereby making the adhesive strength of an adhesive layer almost disappear. A Bernoulli chuck is moved close from the back side of the semiconductor wafer to separate the semiconductor wafer in a non-contact manner and to suspension-hold the semiconductor wafer in a state where the semiconductor wafer floats in the air.
|
申请公布号 |
US2005074952(A1) |
申请公布日期 |
2005.04.07 |
申请号 |
US20040938645 |
申请日期 |
2004.09.13 |
申请人 |
MIYAMOTO SABURO;HASE YUKITOSHI |
发明人 |
MIYAMOTO SABURO;HASE YUKITOSHI |
分类号 |
B65G49/07;H01L21/00;H01L21/301;H01L21/304;H01L21/60;H01L21/677;H01L21/683;(IPC1-7):H01L21/30;H01L21/46 |
主分类号 |
B65G49/07 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|