| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To obtain an adhesive composition containing (A) a polyimide resin containing a diorganopolysiloxane bond having a vinyl group on the main chain as an organic substituent, (B) an epoxy resin and (C) an epoxy resin hardening catalyst as essential components, and prepare an adhesive film produced by using the adhesive composition. <P>SOLUTION: The adhesive film produced from the adhesive composition gives high adhesive force to various substrates by thermal bonding and thermal curing, has high adhesive force to a sealing resin, low elastic modulus and high heat-resistance and gives a resin-packaged semiconductor device having high reliability. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
