发明名称 MANUFACTURING METHOD OF SOLID-STATE IMAGING DEVICE
摘要 PROBLEM TO BE SOLVED: To manufacture a solid-state imaging device where a plurality of kinds of photodiodes having different characteristics are provided and the dopant profile of each kind of a photodiode is adjusted. SOLUTION: A second conductive area is formed on a first conductive semiconductor substrate. In the second conductive area, a plurality of first conductive vertical CCD channels are formed. Over the plurality of vertical CCD channels, a plurality of vertical transfer electrodes are formed to obtain a vertical CCD part together with the plurality of vertical CCD channels. In the second conductive area, a first conductive dopant is injected from a direction of crossing the nomal line direction of the semiconductor substrate to form a first dopant layer. In the second conductive area, the first conductive dopant is injected from a direction of crossing the normal line direction of the semiconductor substrate to form a second dopant layer. Between the first and second dopant layers, a third dopant layer of a second conductive type is formed. Over the first, second, and third dopant layers in the second conductive area, a fourth dopant layer of the second conductive type is formed. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005093866(A) 申请公布日期 2005.04.07
申请号 JP20030327663 申请日期 2003.09.19
申请人 FUJI FILM MICRODEVICES CO LTD;FUJI PHOTO FILM CO LTD 发明人 TAKEUCHI YUTAKA;SHIBATA KATSUHIRO
分类号 H01L27/148;H01L31/10;H04N5/335;H04N5/369;H04N5/372;(IPC1-7):H01L27/148 主分类号 H01L27/148
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