发明名称 WIRING FORMING METHOD, MINUTE TILE-LIKE ELEMENT, CIRCUIT DEVICE AND ELECTRONIC APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a wiring forming method, a minute tile-like element, a circuit device and an electronic apparatus, in which when an electric wiring is formed using a liquid material, a minute wiring pattern and an electric wiring having high reliability can be formed. SOLUTION: A projected dike 16a is provided so as to surround at least a part of an electrode 51 provided on a final substrate 50, and the liquid material containing a conductive material is coated in a wiring region surrounded by the dike 16a, whereby an electric wiring 53 is formed in the wiring region. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005093702(A) 申请公布日期 2005.04.07
申请号 JP20030324711 申请日期 2003.09.17
申请人 SEIKO EPSON CORP 发明人 KONDO TAKAYUKI
分类号 H01L21/331;H01L21/3205;H01L29/737;H01S5/042;H01S5/183;(IPC1-7):H01L21/320 主分类号 H01L21/331
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