| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed circuit board and a method of manufacturing thereof improved in moisture resistance of a printed circuit board as a whole, ensured in connection reliability, repair property and high frequency characteristic, and also improved in mechanical strength such as bending rigidity or the like of an electrical insulating base material. SOLUTION: A through-hole (103) opened in the thickness direction of an electric insulating base material (102) is filled with a conductor material (104) including a conductive filler, a wiring layer (106) formed in the predetermined pattern is electrically connected with the conductor material (104) to both surfaces of the electrical insulating base material (102), the electrical insulating base material (102) is formed with the base material impregnated with a thermosetting modified cyanate ester formed by mixing fine particles into a glass cloth or unwoven glass cloth, and the average grain particle of the conductive filler included in the conductor material (104) is larger than the average grain size of the fine particles. COPYRIGHT: (C)2005,JPO&NCIPI
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