| 摘要 |
PROBLEM TO BE SOLVED: To provide the element for measuring processing dimension of a semiconductor device which is capable of easily evaluating the processing dimension of a connection hole with high accuracy through an electrical measuring method. SOLUTION: The element for measuring processing dimension is equipped with a measuring element pair, which is provided with connection holes 7a and 7a that are bored in an insulating layer 5 and arranged adjacent to each other, while being electrically insulated from each other, and upper measuring conductive films 3a and 3a and lower measuring conductive films 11a and 11a which are provided above and below the connection holes 7a and 7a, respectively; and a reference element pair, which is composed of upper reference conductive films 17a and 17a, and lower reference conductive films 23a and 23a, having the same configuration with the measuring conductive films 3a and 3a and lower measuring conductive films 11a and 11a. COPYRIGHT: (C)2005,JPO&NCIPI
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