发明名称 |
Method for fabricating semiconductor device capable of preventing damage by wet cleaning process |
摘要 |
A method for fabricating a semiconductor device capable of preventing an inter-layer insulation layer from being damaged during a wet cleaning process. The method includes the steps of: forming a plurality of conductive structures on a substrate; forming an etch stop layer and a flowable insulation layer on the plurality of conductive structures subsequently; forming a photoresist pattern on the flowable insulation layer; forming a plurality of contact holes by etching the flowable insulation layer with use of the photoresist pattern as an etch mask, thereby exposing portions of the etch stop layer; forming at least one barrier layer on the contact holes; removing said at least one barrier layer and the etch stop layer disposed at each bottom portion of the contact holes to thereby expose the substrate; and cleaning the contact holes.
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申请公布号 |
US2005074965(A1) |
申请公布日期 |
2005.04.07 |
申请号 |
US20040880953 |
申请日期 |
2004.06.29 |
申请人 |
LEE SUNG-KWON;LEE MIN-SUK |
发明人 |
LEE SUNG-KWON;LEE MIN-SUK |
分类号 |
H01L21/28;H01L21/3105;H01L21/316;H01L21/4763;H01L21/60;H01L21/768;H01L21/8242;(IPC1-7):H01L21/824;H01L21/476 |
主分类号 |
H01L21/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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