发明名称 Circuit board arrangement for mobile telephones and laptops comprises a circuit board layer, a component arranged on the circuit board layer, and a positioning element formed on the circuit board layer for fixing the component on the layer
摘要 <p>Circuit board arrangement (LA) comprises a circuit board layer (PCB), a component (C) arranged on the circuit board layer, and a positioning element (P) formed on the circuit board layer for fixing the component on the layer. An independent claim is also included for a process for the production of the circuit board arrangement.</p>
申请公布号 DE10343065(A1) 申请公布日期 2005.04.07
申请号 DE2003143065 申请日期 2003.09.16
申请人 SIEMENS AG 发明人 RESSEL, JOSEF
分类号 H01L23/538;H05K1/18;H05K3/30;H05K3/46;(IPC1-7):H05K1/18;H05K1/11 主分类号 H01L23/538
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