发明名称 |
Circuit board arrangement for mobile telephones and laptops comprises a circuit board layer, a component arranged on the circuit board layer, and a positioning element formed on the circuit board layer for fixing the component on the layer |
摘要 |
<p>Circuit board arrangement (LA) comprises a circuit board layer (PCB), a component (C) arranged on the circuit board layer, and a positioning element (P) formed on the circuit board layer for fixing the component on the layer. An independent claim is also included for a process for the production of the circuit board arrangement.</p> |
申请公布号 |
DE10343065(A1) |
申请公布日期 |
2005.04.07 |
申请号 |
DE2003143065 |
申请日期 |
2003.09.16 |
申请人 |
SIEMENS AG |
发明人 |
RESSEL, JOSEF |
分类号 |
H01L23/538;H05K1/18;H05K3/30;H05K3/46;(IPC1-7):H05K1/18;H05K1/11 |
主分类号 |
H01L23/538 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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