| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent the surface of a plating liquid in a plating tank from getting rough, even when stirring efficiency for the plating liquid has been further increased. <P>SOLUTION: This plating apparatus comprises a wafer-supporting plate 3 and an anode electrode 4 vertically arranged so as to face each other in the plating liquid 2 in the plating tank 1; and an electric field-shielding plate 7 having an open hole 9 and an impeller 15 for stirring the plating liquid 2 around the open hole 9 vertically arranged between the wafer-supporting plate 3 and the anode electrode 4. The electric field-shielding plate 7 shields the electric field generated by the anode electrode 4 having a slightly larger size than a semiconductor wafer 6, in the region except the open hole 9 to secure the uniformity of a plated film within the surface of a semiconductor wafer 6; and prevents the surface of the plating liquid 2 in the plating tank 1 from getting rough, even when a rotational speed of the impeller 15 has been increased to an extent, or equivalently, the stirring efficiency for the plating liquid 2 has been further increased. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
