| 摘要 |
PROBLEM TO BE SOLVED: To provide an electroless plating device capable of promoting the plating reaction by applying the current for a predetermined time after starting the plating reaction. SOLUTION: The electroless plating device has an external power supply capable of applying the current for a predetermined time at least from starting the plating reaction, a member to electrically connect the external power supply to a part of an object to be plated, and an electrode facing the object to be plated. The object is a substrate for a magnetic disk, and the member for electric connection is a conductive member disposed only on a portion in contact with the substrate for the magnetic disk of a disk supporting shaft. The conductive member is the electroless plating apparatus connected to the external power supply. COPYRIGHT: (C)2005,JPO&NCIPI
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