发明名称 |
Integrated circuit package bond pad having plurality of conductive members |
摘要 |
An integrated circuit package bond pad includes an insulating layer and an electrode located over the insulating layer. The electrode has a first surface configured to be bonded to external circuitry and a second surface opposite the first surface. A plurality of conductive members is located in the insulating layer, wherein ones of the plurality of conductive members contact the second surface of the electrode.
|
申请公布号 |
US2005073058(A1) |
申请公布日期 |
2005.04.07 |
申请号 |
US20030680664 |
申请日期 |
2003.10.07 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
KUO YIAN-LIANG;LIN YU-CHANG |
分类号 |
H01L23/485;(IPC1-7):H01L23/48;H01L29/40 |
主分类号 |
H01L23/485 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|