Multilayer probe structure (98) for testing semiconductor die are electrochemically fabricated via depositions of one or more materials (94, 96) in a plurality of overlaying and adhered layers. In some embodiments the structures (98) may include generally helical shaped configurations (100), helical shape configurations (502) with narrowing radius as the probe extends outward from a substrate (82), bellows-like configurations (200), and the like. In some embodiments arrays of multiple probes are provided.
