发明名称 Electrodeposited layer
摘要 A thin layer of precious metal that is electroplated through a mask onto a conductive substrate, as to form gold plated contacts, is formed with numerous microscopic recesses to produce a microscopically rough surface and to reduce the amount of gold or other precious metal that is used for a layer of predetermined thickness. A screen formed with microscopic holes, such as a woven mesh, lies between an elastomeric mask that defines the outline of the deposited layer and a face of the metal substrate, the screen being compressed between them. The combination is dipped in an electrolytic bath, where electrolyte flows through the microscopic holes of the screen, so the metal is plated on a face of the substrate, but is plated with recesses where threads of the screen have laid adjacent to the substrate face.
申请公布号 US2005074934(A1) 申请公布日期 2005.04.07
申请号 US20040783239 申请日期 2004.02.19
申请人 GUYOT JEAN-LOUIS 发明人 GUYOT JEAN-LOUIS
分类号 C25D5/02;C25D5/16;C25D7/06;H01L23/495;H01R13/03;(IPC1-7):H01L21/823 主分类号 C25D5/02
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