发明名称 PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM AND FABRICATED ARTICLE USING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which can be developed with an aqueous alkali solution such as an aqueous sodium hydroxide solution or an aqueous sodium carbonate solution and exhibits excellent long-term reliability while having good flexibility, bendability and heat resistance as properties of a film after imidation by heat treatment after development, and to provide a dry film using the same. <P>SOLUTION: The photosensitive resin composition comprises (A) a polyimide precursor having a specified structure, (B) a compound having at least two or more photopolymerizable unsaturated double bonds and (C) a photopolymerization initiator. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005091421(A) 申请公布日期 2005.04.07
申请号 JP20030320953 申请日期 2003.09.12
申请人 MITSUI CHEMICALS INC 发明人 OOKAWADO ETSUO;TAWARA SHUJI;FUJITA KAZUTO;FUNAKI KATSUHIKO
分类号 G03F7/037;C08G73/16;G03F7/004 主分类号 G03F7/037
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