| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor package which can control the amount of burrs generated at the time of cutting for providing each semiconductor package piece, urges the formation of solder fillet to a connecting part when a substrate is mounted, and can improve heat radiation property of semiconductor chip. <P>SOLUTION: The semiconductor package is manufactured by forming many wiring patterns of a semiconductor package to a lead frame 1 formed of a conductor plate, forming an elongated via-hole 13 to the position used in common by the adjacent wiring patterns, sealing with resin the entire part of the lead frame after the semiconductor chip 2 is mounted and the wiring is laid, and suppressing burrs b by sharing the via-hole 13 with a cutting wire. Moreover, a recess 11a for accelerating heat radiation of the predetermined depth is formed on the side of a mounting surface of a stage 11 to mount the semiconductor chip of lead frame, and a corner 5 for promoting fillet is formed on the external circumference portion at the lower end surface of the semiconductor package. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
